Original HUAWEI OSN 8800 DWDM Transmission Equipment
Short Description:
| Dimensions (mm) | |
| 498 (W) x 295 (D) x 450 (H) | |
| 498 (W) x 295 (D) x 900 (H) | 442 (W) x 295 (D) x 397 (H) |
| Number of slots for service boards | |
| 16 | |
| 32 | 16 |
| Switch | |
| Optical | 1 to 20-degree ROADM |
| Electrical | |
| 1.6T ODUk(k=0, 1, 2, 2e, 3, 4, flex) 640G VC-4 and 20G VC-3/VC-12 800G Packet | |
| Enhanced subrack: 3.2T ODUk(k=0, 1, 2, 2e, 3, 3e, 4, flex) 1.28T VC-4 and 80G VC-3/VC-12 1.6T Packet General subrack: 2.56T ODUk(k=0, 1, 2, 2e, 3, 4, flex) 1.28T VC-4 and 80G VC-3/VC-12 640G Packet | N/A |
| Wavelength (max) | |
| DWDM: 96-ch, CWDM: 8-ch | DWDM: 96-ch |
| Center wavelength range | |
| DWDM: 1529.16 nm to 1567.13 nm (extend C-band, ITU-T G.694.1) CWDM: 1471 nm to 1611 nm (Band S+C+L, ITU-T G.694.2) | DWDM: 1529.16 nm to 1567.13 nm (extended C-band, ITU-T G.694.1) |
| Max. rate per channel | 200 Gbit/s (OTUC2) |
| Service types supported | SDH, SONET, Ethernet, SAN, OTN, Video |
| Line rate | 2.5 Gbit/s, 10 Gbit/s, 40 Gbit/s, 200 Gbit/s |
| Supported pluggable optical modules | eSFP, SFP+, XFP, CFP |
| Max. capacity per PID group | |
| 200 Gbit/s | N/A |
| Topology | Point-to-point, chain, star, ring, ring-with-chain, tangent ring, intersecting ring, mesh |
| Redundancy and protection | |
| Network level protection (OTN) | |
| Optical line protection, intra-board 1+1 protection, client 1+1 protection, ODUk SNCP, tributary SNCP, SW SNCP, ODUk SPRing protection, OWSP | Optical line protection, intra-board 1+1 protection, client 1+1 protection, SW SNCP, OWSP |
| Network level protection (OCS) | |
| Linear MSP, MSP ring, transoceanic MSP ring, SNCP, SNCTP | |
| Network level protection (Ethernet and packet) | |
| DBPS, DLAG, ERPS, LAG, LPT, MC-LAG, MSTP, PW APS, STP and RSTP, Tunnel APS, VLAN SNCP | |
| DBPS, DLAG, ERPS, LAG, LPT, MC-LAG, MSTP, PW APS, STP and RSTP, Tunnel APS, VLAN SNCP | N/A |
| Equipment level protection | |
| Power redundancy, fan redundancy, cross-connect board redundancy, system control and communication board redundancy, centralized clock board redundancy, AUX board 1+1 redundancy | Power redundancy, fan redundancy, system control and communication board redundancy |
| Optical power management | ALS, AGC, ALC, APE, IPA, OPA |
| Synchronization | Synchronous Ethernet clock IEEE 1588v2 2 Mbit/s or 2 MHz (with the SSM function), ITU-T G.703-compliant external clock source External time source (1PPS+TOD) |
| ASON | |
| An OTN network supports the Optical-Layer ASON and electrical-Layer ASON. An OCS network supports the SDH ASON feature. NOTE: The OptiX OSN 8800 T16 does not support the SDH ASON feature. | An OTN network supports the Optical-Layer ASON |
| Submarine Features | Supports application of extended C band in submarine scenarios. |
| Nominal working voltage | -48 V DC/-60 V DC |
| Typical configuration power consumption | |
| OTN subrack: 700W OCS subrack: 821W | |
| Enhanced 8800 T32 OTN subrack: 3300W OCS subrack: 1791W General 8800 T32 OTN subrack: 2000W OCS subrack: 1282W | N/A |
| Maximum subrack power consumptionb | |
| 1800W | |
| Enhanced 8800 T32: 4800W General 8800 T32: 4800W | 2400W |
| Operation environment | Subrack temperature: Long-term operation: 5°C (41 °F) to 45°C (113 °F) Short-term operation: -5°C (23 °F) to 55°C (131 °F) Relative humidity: Long-term operation: 5% to 85% Short-term operation: 5% to 95% |
| Mean time to repair (MTTR) | |
| 4 hours | |
| 4 hours | 4 hours |
| Mean time between failures (MTBF) | |
| 62.80 years | |
| 60.40 years | 51.64 years |
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